Електронні частин : BSM100GB170DN2

Виробник : Siemens Semiconductor Group

Упаковка :

Pins :

Опис : IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)

Температура : Хв °C | Макс °C

Datasheet : BSM100GB170DN2 PDF

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• BSM100GB170DN2